粉体行业在线展览
面议
641
此设备在样本和载玻片之间提供均匀的厚度。将样品粘合到载玻片上是薄切片制备中的关键步骤。成功的切割,研磨和抛光很大程度上依赖于粘片质量,即**限度地减少胶层的厚度。首先,在载玻片和试样上涂上一薄层环氧树脂,然后将样品精确黏贴,为了提高粘合效率,应将组件放置在加热的粘合机上,使其在压力和温度下高质量的粘合。此设备可同时处理*多12个小尺寸样品(26x46,27x47,28x48,30x45),6个大样品(50x75)或6个小样品和3个大样品的组合。
温度:可调节范围20至130℃
重量:10公斤
尺寸:217x124x708毫米
电源:220VAC,50/60Hz
可调节加热温度
无弹簧设计,每个样品可独立设置压力
同时处理12个样本且保持恒温(高达80℃)
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The bonding jig is designed to provide a uniform thickness of bonding material between specimens and glass sides. Bond the rock sample on its glass slide is a very important step in the thin section preparation. The success of grinding, lapping and polishing steps depends of the quality of bonding. The objective is to obtain very thin layers of glue. First, a thin layer of epoxy resin is applied on both the glass slide and the specimen. The glass slide is then manually stuck on the sample. To improve the bonding, the complete assembly is placed on the heating bonding press which allows to bond specimen and glass slide under pressure and temperature: The specimen is pressed on its glass slide thanks to an individual weight whereas the temperature is controlled from 20°C to 130°C +/- 2°C to ensure perfect bonding. Weight: Dimensions: Power supply: |
FORJ
德国MicroTec—CUT4055
Spex 3636 X-Press® 实验室用自动压片机
PD-10电镜粉末制样仪
全自动切片机
YPZ-GZ110L
SPEED wave
ZYP-X60T
XHLQM-30