粉体行业在线展览
bohp
70-80万元
bohp
2959
高纯镉:99.999% Cd-5N-I-7
检测杂质:Ag, Al, Bi, Ca, Cr, Cu, Fe, Mg, Ni,Pb, Sb, Zn, Sn
杂质总含量:≤10ppm
高纯镉:99.9999% Cd-6N-I-8
检测杂质:Ag, Al, Bi, Cr, Cu, Fe, Mg, Ni, Pb,Sb, Zn, Sn
杂质总含量:≤1ppm
高纯镉:99.99999% Cd-7N-I-9
检测杂质:Ag, Al, Bi, Cr, Cu, Fe, Mg, Ni, Pb,Sb, Zn
杂质总含量:≤0.1ppm
用途:主要用于制备Ⅱ-Ⅵ族化合物半导体、高纯合金、电池焊料、核原子反应堆中控制棒,太阳能电池材料等。
包装:涤纶薄膜包装后双层复合膜抽真空包装两次,外套铝箔内充氩气封装或者直接玻璃管真空封装。
Specification:
High purity Cd: 99.999% Cd-5N-I-7
Testing impurity: Ag, Al, Bi, Ca,Cr, Cu, Fe, Mg, Ni, Pb, Sb, Zn, Sn
Totalimpurity content: ≤10ppm
High purity Cd: 99.9999% Cd-6N-I-8
Testing impurity: Ag, Al, Bi, Cr, Cu, Fe, Mg, Ni, Pb, Sb, Zn, Sn
Totalimpurity content: ≤1ppm
Highpurity Cd: 99.99999% Cd-7N-I-9
Testingimpurity: Ag, Al, Bi, Cr, Cu, Fe, Mg, Ni, Pb, Sb, Zn
Totalimpurity content: ≤0.1ppm
Application: Used for preparation Ⅱ-Ⅵ elementschemical compound semiconductor, high purity metal, battery solder and controlrod of atomic reactor. Used as the material of solar cell etc.
Package: Packed with terylene film, anddouble poly-film with vacuum encapsulation, do this twice, then packed withaluminum foil with argon encapsulation, or packed with glass tube with vacuumencapsulation directly.